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3M ? Anisotropic Conductive Film 7371
Typical Physical Properties and
Performance Characteristics (continued)
Note: The following technical information and data should
be considered representative or typical only and
should not be used for specification purposes.
Reliability Performance – Peel Strength (11)
Peel Strength
Test Conditions (gf/cm)
3M TM-2313 (12)
100°C x 1000 hrs > 500
-40°C to 85°C x 1000 cycles
> 500
Ambient Physical Properties – Peel Strength (8)
Boxplot of Peak Peel Strength vs. Bonding Temperature
85°C / 85% r. h. x 1000 hrs
> 500
1400
1200
PI Flex - to - Glass
All Bonds 15sec and 3MPa
Initial Peel Values
Assembly Process Techniques
Assembly Process
1000
800
600
400
200
0
147
160
180 190
Temperature ( ° C)
200
210
A source of heat and pressure, such as a thermo-compression
(hot bar) bonder is required for use of 3M? Anisotropic
Conductive Film 7371. Several commercially available
models exist; a list of vendors can be obtained by calling the
toll free number on the back of this Technical Data Sheet.
Bonding of 3M ACF 7371 requires a three-part procedure:
Tacking the film to one substrate (pre-tacking)
Reliability Performance – Electrical Contact
(9)
Removing the release liner
Test Conditions
100°C x 1000 hrs
-40° to 85°C x 1000 cycles
85°C / 85% r. h. x 1000 hrs
Interconnect Resistance
(mOhms)
3M TM-2314 (10)
< 100
< 100
< 100
Bonding the first substrate to the second substrate.
A pre-tacking temperature of 90°C under a pressure of
about 10 kg/cm 2 should be used (see Table below). For
automated ACF application: Set the ACF pretacking
equipment to deliver the conditions provided in the
Tacking and Bonding Conditions Table below. Slight
adjustment to these conditions may be necessary for each
application or for different types of circuitry. For manual
ACF application: Cut the adhesive to the size of the flex
circuit. Place the adhesive on the flex and set flex on hot
plate at setpoint up to 90°C. Use roller to press adhesive
onto the flex. After allowing flex and adhesive to cool,
remove liner.
(8)
(9)
Measured for gold/nickel/copper polyimide flex circuits bonded to glass.
Pad pitch was 100 microns.
Measured for gold/nickel/copper polyimide flex circuits bonded to Ag-Ink/
indium-tin-oxide/polyester. Contact overlap area was 2.0 sq. mm. Pad pitch
(11)
(12)
Measured for gold/nickel/copper polyimide flex circuits bonded to Ag-Ink/
ITO/polyester. Contact overlap area was 2.0 sq. mm. Pad pitch was 2 mm.
3M internal test method TM-2313 based on test method IPC 650 - Section
2.4.9.1.
was 2 mm. Also, measured for gold/nickel/copper polyimide flex circuits
bonded to printed circuit board. Overlap area was 0.38 sq. mm. Pad pitch
was 500 microns.
(10)
3M internal test method TM-2314 based on IPC 650 - Section 2.6.24. The
flex has the shorting strap located near the bond-line to approximate a
4-wire test structure and eliminate most extraneous resistance in the
measurement due to the circuit lines.
(2)
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